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SICK unveils new photoelectric and 3D sensors at PACK EXPO
The SureSense and TriSpector products expand sensing needs on the production line.
Oct 1, 2015
How to Honor a Leader
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago.
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