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Schneider Electric Unveils IIoT-Ready PLCs, AR, and Motion

Demos of IIoT box as server for hands-free augmented reality and next-generation of motor controls.

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How to Honor a Leader
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago.
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