Electric and Pneumatic Automation Platform
Festo debuts the company’s new distributed I/O solution, CPX-AP-A with modules attached within a terminal.
Sep 13, 2023
How to Honor a Leader
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago.
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