PACK EXPO debut for OEM packaging group

ITW Dynatec restructured its operations to establish a dedicated packaging group exclusively focused on the needs of packaging original equipment manufacturers (OEMs) and end user companies.

Aug 28, 2015

The company will feature its growth-oriented solutions for the packaging market at Pack Expo 2015, Las Vegas Convention Center, Las Vegas, NV, September 28-30, Booth C-3301.

In addition to Scott Holzwarth, Global Business Unit Manager - Packaging for ITW Dynatec, a group of ITW Dynatec hot melt experts and technicians will be attending Pack Expo this year.

ITW Dynatec

List: Digitalization Companies From PACK EXPO

Sponsor the 2026 Packaging Recycling Summit

Hands-On, Not Handbooks: CPGs Rethink Operator Training Strategies

Operators say training materials need to shift away from manuals and incorporate visual,video, and troubleshooting elements.

Cyril Perducat, CTO at Rockwell, shared at Automation Fair about the shift from programmed factories to autonomous operations.

Rockwell Automation Charts an Autonomous, Human-Centered Industrial Future

PMMI Foundation Awards More Than $160,000 in 2025 Scholarships to Emerging Leaders in Packaging & Processing

unPACKed Podcast: How to Fix the #1 Mistake Trade Show Exhibitors Make

Said panelist Stu Shepherd during the webinar, “The ability to get started in automation is easier now than it’s ever been before. The ease of use and all this is such that you really don’t have to have PhDs and scholars of other types on your staff to operate these systems. The systems will run. You just have to get out there and deploy.”

Automation Aligns Around Standards, AI, and Real-World Use

Sponsor the 2026 Packaging Recycling Summit

The Packaging Recycling Summit (PRS) is the premier U.S. conference for strengthening packaging circularity. In 2026, PRS is transforming into a fully immersive experience where attendees will solve problems, forge partnerships, and explore technologies that are reshaping packaging recovery. Directly connect with sustainable OEM’s at this highly coveted event.

Learn More

List: Digitalization Companies From PACK EXPO

Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.

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Products

Impulse Heat Sealing Technology

PackworldUSA and TOSS Machine Components highlight advances in impulse heat sealing technology, including closed-loop, temperature-regulated controls that improve seal consistency, validation, and compliance for medical, industrial, and advanced manufacturing packaging applications.

PACK EXPO debut for OEM packaging group

ITW Dynatec

List: Digitalization Companies From PACK EXPO

Sponsor the 2026 Packaging Recycling Summit

Hands-On, Not Handbooks: CPGs Rethink Operator Training Strategies

Rockwell Automation Charts an Autonomous, Human-Centered Industrial Future

PMMI Foundation Awards More Than $160,000 in 2025 Scholarships to Emerging Leaders in Packaging & Processing

unPACKed Podcast: How to Fix the #1 Mistake Trade Show Exhibitors Make

Automation Aligns Around Standards, AI, and Real-World Use

Impulse Heat Sealing Technology

Easy-Access Reject Device for Gravity Inspection

Steel Internal Gears

Winter OEM 2025

Fall OEM 2025

Summer OEM 2025

Spring OEM 2025

Researched List: Digitalization Companies from PACK EXPO, catered to CPG

Rethinking Packaging Robotics: Prioritizing Flexibility to Combat “Brittleness”

Researched List: Small Language Models for Packaging & Processing OEMs

The Digitalization Effect