PACK EXPO debut for OEM packaging group

ITW Dynatec restructured its operations to establish a dedicated packaging group exclusively focused on the needs of packaging original equipment manufacturers (OEMs) and end user companies.

Aug 28, 2015
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The company will feature its growth-oriented solutions for the packaging market at Pack Expo 2015, Las Vegas Convention Center, Las Vegas, NV, September 28-30, Booth C-3301.

In addition to Scott Holzwarth, Global Business Unit Manager - Packaging for ITW Dynatec, a group of ITW Dynatec hot melt experts and technicians will be attending Pack Expo this year.

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ITW Dynatec
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