Next-Gen Intelligent Transport Technology

The mechatronic solution minimizes machine footprint and reduces raw material and energy consumption.

During PACK EXPO, Beckhoff unveiled the next revolution in its packaging technology. Many new products made their North American debut during the show, including the eXtended Transport System (XTS). Now available in the U.S., the XTS implements flexible changeovers in seconds with less required components, the company says. At the same time, the mechatronic solution minimizes machine footprint and reduces raw material and energy consumption.

 

Sponsor the 2026 Packaging Recycling Summit
The Packaging Recycling Summit (PRS) is the premier U.S. conference for strengthening packaging circularity. In 2026, PRS is transforming into a fully immersive experience where attendees will solve problems, forge partnerships, and explore technologies that are reshaping packaging recovery. Directly connect with sustainable OEM’s at this highly coveted event.
Learn More
Sponsor the 2026 Packaging Recycling Summit