Next-Gen Intelligent Transport Technology

The mechatronic solution minimizes machine footprint and reduces raw material and energy consumption.

During PACK EXPO, Beckhoff unveiled the next revolution in its packaging technology. Many new products made their North American debut during the show, including the eXtended Transport System (XTS). Now available in the U.S., the XTS implements flexible changeovers in seconds with less required components, the company says. At the same time, the mechatronic solution minimizes machine footprint and reduces raw material and energy consumption.

 

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List: Digitalization Companies From PACK EXPO
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