Label media for ink-jet printer/cutters

• FLEXcon's FLEXmark specialized pressure-sensitive polypropylene media for labeling applications is suited for short-run label production

Jan 10, 2011
Hp 19611 Fle Xmark Media


• for Roland's VersaUV LEC series of UV-LED wide-format ink-jet printer/cutters

• PP20CPLEC (2-mil clear), PP23WPLEC (2.3-mil white), and MPP20SPLEC (2-mil metalized sliver) are available in 30-in.-W rolls

FLEXcon Co., Inc.
Roland DGA
Companies in this press-release
FLEXcon Co. Inc.; Roland DGA
Discover Leading Suppliers
Recommended
Discover Leading Suppliers
Sponsor the 2026 Packaging Recycling Summit
Recommended
Sponsor the 2026 Packaging Recycling Summit
Top Stories
51mymsu3 720
Operations & IT
End of the Line Video Series: Spee-Dee's Digital Dennis Update, Progress in Industrial Compostability, and Other AI News
Watch as some of the PMG editors sit down and talk about trends, insights, and the cool things that pass by our desks.
Un Pac Ked 50 K Light Bg
Management
unPACKed Podcast: The Economic Trends Every Business Should Watch
Screenshot 2026 05 27 At 1 35 52 Pm
Business Intelligence
Why Post-Installation Training Makes or Breaks Packaging Lines
Pmmi Logo
PACK EXPO
PMMI Launches New CPG NexGen Awards to Celebrate the Future Leaders of Packaging and Processing
Oem 0626 Women's Leadership She Leads Stock Image
PPWLN
Leadership for Women in a Male-Dominated Industry
Sponsor the 2026 Packaging Recycling Summit
The Packaging Recycling Summit (PRS) is the premier U.S. conference for strengthening packaging circularity. In 2026, PRS is transforming into a fully immersive experience where attendees will solve problems, forge partnerships, and explore technologies that are reshaping packaging recovery. Directly connect with sustainable OEM’s at this highly coveted event.
Learn More
Sponsor the 2026 Packaging Recycling Summit
Products
Cognex OneVision
AI Vision Development Platform
Cognex OneVision adoption ramps as manufacturers scale AI vision globally: Customers report faster deployment, improved throughput, and new levels of collaboration.
Fieldbus Modular Remote I/O Series
Leak Detection Sensor
More Products
In Print
OEM Magazine Summer OEM 2026
Summer OEM 2026
OEM Magazine Spring OEM 2026
Spring OEM 2026
OEM Magazine Winter OEM 2025
Winter OEM 2025
OEM Magazine Fall OEM 2025
Fall OEM 2025
SubscribeArchives
Downloads
View More »
Hero Shot
Automation
AI Hits the Plant Floor
Adobe Stock 476289832
Workforce
Researched List: Digitalization Companies from PACK EXPO, catered to CPG
Pw Robotics 1 E Book 2024 Cover Fullsize
Robotics
Rethinking Packaging Robotics: Prioritizing Flexibility to Combat “Brittleness”
557 Oem Language Models
Machine Design
Researched List: Small Language Models for Packaging & Processing OEMs
View More »