SICK, Inc: Photoelectric sensor

Sick’s W4S-3 photoelectric sensor incorporates OES3 technology into its third generation custom ASIC (application-specific integrated circuit) to ignore stray background reflections, detect multi-colored or shiny objects, and provide high immunity to ambient light.

Feb 6, 2010

Sensors feature a smooth, IP 69K stainless steel housing that withstands harsh wash down applications. Housing also reduces bacteria growth that can result when food particles become lodged in small grooves or crevices.

SICK, Inc.

Sponsor the 2026 Packaging Recycling Summit

List: Digitalization Companies From PACK EXPO

Accutek's Vista, California Headquarters

Turnkey at Speed: Accutek’s 80/20 Approach to Custom Builds

The second-generation OEM prebuilds “ready-to-customize” bottling equipment, then adapts them to spec, reducing build variability while improving throughput and consistency.

OEM Training Tools Lag Behind Operator Needs

The report notes that “getting the most engineering out of the engineers” boosts both productivity and retention.

Fighting Back Against Engineering Teams That Are Stretched Thin

A Blueprint for Predictive-Ready Packaging and Processing Equipment

unPACKed Podcast: How AI Can Keep Your Throughput Up & Downtime Down

Sponsor the 2026 Packaging Recycling Summit

The Packaging Recycling Summit (PRS) is the premier U.S. conference for strengthening packaging circularity. In 2026, PRS is transforming into a fully immersive experience where attendees will solve problems, forge partnerships, and explore technologies that are reshaping packaging recovery. Directly connect with sustainable OEM’s at this highly coveted event.

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List: Digitalization Companies From PACK EXPO

Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.

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Products

Balluff Inc.'s BOS R072K Optical Sensor Entry Line

SICK, Inc: Photoelectric sensor

SICK, Inc.

Sponsor the 2026 Packaging Recycling Summit

List: Digitalization Companies From PACK EXPO

Turnkey at Speed: Accutek’s 80/20 Approach to Custom Builds

OEM Training Tools Lag Behind Operator Needs

Fighting Back Against Engineering Teams That Are Stretched Thin

A Blueprint for Predictive-Ready Packaging and Processing Equipment

unPACKed Podcast: How AI Can Keep Your Throughput Up & Downtime Down

Industrial Optical Sensor Series

Elastic MES Platform

Hygienic Robotic Collate and Load System

Winter OEM 2025

Fall OEM 2025

Summer OEM 2025

Spring OEM 2025

Researched List: Digitalization Companies from PACK EXPO, catered to CPG

Rethinking Packaging Robotics: Prioritizing Flexibility to Combat “Brittleness”

Researched List: Small Language Models for Packaging & Processing OEMs

The Digitalization Effect