3D displacement sensor addresses food-portion control

A new customer-driven solution from Cognex uses the D1300 3D displacement sensor and the Cognex Designer custom interface to calculate the volume of dispensed food for each individual item in a tray.

Oct 1, 2015

Cognex Corporation

List: Digitalization Companies From PACK EXPO

List: Digitalization Companies From PACK EXPO

Pod Airpods

unPACKed Podcast: Navigating Trade Shows as a Woman

Hear Amber Miller of PMMI Media Group host a special Packaging & Processing Women’s Leadership Network conversation on how women in manufacturing can get the most out of trade shows.

Generative AI's effect on manufacturing is more than some may expect.

Three Ways Generative AI is Delivering Manufacturing Results

Industry professionals note three keys to startup success, focusing on a collaboration-based mindset.

Industry Professionals Note Keys to Vertical Startup Success

Ori Cohen, president and founder of Orics Industries, is shown here in the firm’s 40,000 square foot manufacturing facility in Farmingdale, N.Y.

OEM Profile: MAP put Orics on the Map

Teams compete with their packaging machinery at PACK EXPO International after a semester and a half of building.

How The PACK Challenge Builds Tomorrow’s Packaging Workforce

List: Digitalization Companies From PACK EXPO

Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.

List: Digitalization Companies From PACK EXPO

Products

Weidmuller's new unmanaged SPE Switch

Single Pair Ethernet (SPE) Switch

Weidmuller USA's SPE Switch offers seamless industrial ethernet connectivity: Agreement on unified connector design and SPE mating face kicks off momentum to adopt future-proof communication and the backbone of industrial connectivity.

Wide Beam Sensor

Robot Simulation Software

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Researched List: Digitalization Companies from PACK EXPO, catered to CPG

Pw Robotics 1 E Book 2024 Cover Fullsize

Rethinking Packaging Robotics: Prioritizing Flexibility to Combat “Brittleness”

557 Oem Language Models

Researched List: Small Language Models for Packaging & Processing OEMs

Oem 2022 Digitalization Base Hero

The Digitalization Effect