Laser marking system

Lumonics' (Oxnard, CA) latest generation of the Xymark(TM) Series of low-cost laser marking systems can code up to four lines of text on moving products.

Jun 30, 1996

New software permits more legible and permanent codes up to 34 dots H, as well as date and time offsets, multiple operating languages and encrypted coding. A reduced footprint measures 24" x 163/4". Operates at up to 650 characters/ sec.

Synrad

List: Digitalization Companies From PACK EXPO

Teams compete with their packaging machinery at PACK EXPO International after a semester and a half of building.

How The PACK Challenge Builds Tomorrow’s Packaging Workforce

The PACK Challenge offers high school students hands-on experience in packaging, fostering industry interest and providing CPGs with opportunities to support future talent.

Four key recommendations surface for OEMs to improve their offerings.

Actionable Steps to Improve Aftermarket Parts and Services

Survey: Automation and Robotics Makes Its Way to Secondary & End-of-Line

unPACKed Podcast: Boost PACK EXPO ROI with Free Invite Tips

Safety Upgrade Boosts Finnish Cable Maker's Productivity

List: Digitalization Companies From PACK EXPO

Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.

Download Now

Products

Advanced Seal Inspection System For Closed Valve Bags

Laser marking system

Synrad

List: Digitalization Companies From PACK EXPO

How The PACK Challenge Builds Tomorrow’s Packaging Workforce

Actionable Steps to Improve Aftermarket Parts and Services

Survey: Automation and Robotics Makes Its Way to Secondary & End-of-Line

unPACKed Podcast: Boost PACK EXPO ROI with Free Invite Tips

Safety Upgrade Boosts Finnish Cable Maker's Productivity

Seal Inspection System for Closed Valve Bags

Wrap Coupling

AFA Systems to Showcase New Case Packing Platform for Bottles at PACK EXPO 2025

Summer OEM 2025

Spring OEM 2025

Winter OEM 2024

Fall OEM 2024

Researched List: Digitalization Companies from PACK EXPO, catered to CPG

Rethinking Packaging Robotics: Prioritizing Flexibility to Combat “Brittleness”

Researched List: Small Language Models for Packaging & Processing OEMs

The Digitalization Effect