Siemens Industry Inc: Industrial PCs

Siemens’ Simatic® IPC427C compact Microbox PC and Simatic HMI IPC477C Panel PC use the Intel Core 2 Duo processor to double the computing capacity of its previous models while delivering maintenance-free, 24/7 operation in hostile environments.

Mar 8, 2010

Designed to operate at ambient temperatures of 0 to 50 degrees Celsius, the space-saving, fanless industrial computers are suitable for communication tasks, measuring and open/closed-loop control and operator control and visualization. PCs have been hardened and shielded against vibration, shock, heat and EMC.

Siemens

Sponsor the 2026 Packaging Recycling Summit

List: Digitalization Companies From PACK EXPO

Hands-On, Not Handbooks: CPGs Rethink Operator Training Strategies

Operators say training materials need to shift away from manuals and incorporate visual,video, and troubleshooting elements.

Cyril Perducat, CTO at Rockwell, shared at Automation Fair about the shift from programmed factories to autonomous operations.

Rockwell Automation Charts an Autonomous, Human-Centered Industrial Future

PMMI Foundation Awards More Than $160,000 in 2025 Scholarships to Emerging Leaders in Packaging & Processing

unPACKed Podcast: How to Fix the #1 Mistake Trade Show Exhibitors Make

Said panelist Stu Shepherd during the webinar, “The ability to get started in automation is easier now than it’s ever been before. The ease of use and all this is such that you really don’t have to have PhDs and scholars of other types on your staff to operate these systems. The systems will run. You just have to get out there and deploy.”

Automation Aligns Around Standards, AI, and Real-World Use

List: Digitalization Companies From PACK EXPO

Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.

Download Now

Sponsor the 2026 Packaging Recycling Summit

The Packaging Recycling Summit (PRS) is the premier U.S. conference for strengthening packaging circularity. In 2026, PRS is transforming into a fully immersive experience where attendees will solve problems, forge partnerships, and explore technologies that are reshaping packaging recovery. Directly connect with sustainable OEM’s at this highly coveted event.

Learn More

Products

Impulse Heat Sealing Technology

PackworldUSA and TOSS Machine Components highlight advances in impulse heat sealing technology, including closed-loop, temperature-regulated controls that improve seal consistency, validation, and compliance for medical, industrial, and advanced manufacturing packaging applications.

Siemens Industry Inc: Industrial PCs

Siemens

Sponsor the 2026 Packaging Recycling Summit

List: Digitalization Companies From PACK EXPO

Hands-On, Not Handbooks: CPGs Rethink Operator Training Strategies

Rockwell Automation Charts an Autonomous, Human-Centered Industrial Future

PMMI Foundation Awards More Than $160,000 in 2025 Scholarships to Emerging Leaders in Packaging & Processing

unPACKed Podcast: How to Fix the #1 Mistake Trade Show Exhibitors Make

Automation Aligns Around Standards, AI, and Real-World Use

Impulse Heat Sealing Technology

Easy-Access Reject Device for Gravity Inspection

Steel Internal Gears

Winter OEM 2025

Fall OEM 2025

Summer OEM 2025

Spring OEM 2025

Researched List: Digitalization Companies from PACK EXPO, catered to CPG

Rethinking Packaging Robotics: Prioritizing Flexibility to Combat “Brittleness”

Researched List: Small Language Models for Packaging & Processing OEMs

The Digitalization Effect