Hyde Park Electronics: Ultrasonic proximity sensor

Superprox®Model SM300FP Series from Hyde Park Electronics (Dayton, OH) is a low-cost, ultrasonic proximity sensor offering a small (1.3”x0.3”x0.75”), flat-profile housing and reliable detection of all materials at distances of 0.25” to as far as 4” from the sensor face.

Sep 30, 2002

The 12- to 24-vDC sensor can function as either field programmable or fixed-field unit from the factory. Sensor needs no adjustments for detecting different materials such as metals, rubber, or plastics, nor for changing colors, light conditions, or distance to object.

Telemecanique Sensors

Discover Leading Suppliers

Sponsor the 2026 Packaging Recycling Summit

End of the Line Video Series: Spee-Dee's Digital Dennis Update, Progress in Industrial Compostability, and Other AI News

Watch as some of the PMG editors sit down and talk about trends, insights, and the cool things that pass by our desks.

unPACKed Podcast: The Economic Trends Every Business Should Watch

Why Post-Installation Training Makes or Breaks Packaging Lines

PMMI Launches New CPG NexGen Awards to Celebrate the Future Leaders of Packaging and Processing

Oem 0626 Women's Leadership She Leads Stock Image

Leadership for Women in a Male-Dominated Industry

Sponsor the 2026 Packaging Recycling Summit

The Packaging Recycling Summit (PRS) is the premier U.S. conference for strengthening packaging circularity. In 2026, PRS is transforming into a fully immersive experience where attendees will solve problems, forge partnerships, and explore technologies that are reshaping packaging recovery. Directly connect with sustainable OEM’s at this highly coveted event.

Learn More

Products

Hyde Park Electronics: Ultrasonic proximity sensor

Telemecanique Sensors

Discover Leading Suppliers

Sponsor the 2026 Packaging Recycling Summit

End of the Line Video Series: Spee-Dee's Digital Dennis Update, Progress in Industrial Compostability, and Other AI News

unPACKed Podcast: The Economic Trends Every Business Should Watch

Why Post-Installation Training Makes or Breaks Packaging Lines

PMMI Launches New CPG NexGen Awards to Celebrate the Future Leaders of Packaging and Processing

Leadership for Women in a Male-Dominated Industry

AI Vision Development Platform

Fieldbus Modular Remote I/O Series

Leak Detection Sensor

Summer OEM 2026

Spring OEM 2026

Winter OEM 2025

Fall OEM 2025

AI Hits the Plant Floor

Researched List: Digitalization Companies from PACK EXPO, catered to CPG

Rethinking Packaging Robotics: Prioritizing Flexibility to Combat “Brittleness”

Researched List: Small Language Models for Packaging & Processing OEMs