Beckhoff Automation, a provider of automation systems and software, announces another addition to the ultra-compact C60xx series Industrial PCs (IPCs) with the new C6025. This IPC is designed to save space as it delivers high computing performance of the Intel Core i series in a fanless, small-form-factor device. The Intel Core i U processors, with their low power requirements, have made this advancement possible, says the company.
Measuring 82 x 127 x 40 mm and designed to be combine high computing performance with a fanless design, the Microsoft “Azure Certified” C6025 IPC is meant to be used for demanding automation and IoT applications where green, sustainable IT is also a requirement. The Intel Core i U processors are made to deliver Core i performance capabilities yet consume much. less power than other processors of the same series. The 8th Gen Intel Core i U processors used in the C6025 should also offer higher performance at the same price point as previous offerings. With this addition, the Beckhoff portfolio of industry-ready and long-term available IPCs now spans five CPU performance classes—from ARM through to Intel Xeon—for maximum hardware scalability.
The Intel Core i U processors in the IPC, meant to be energy-efficient, in combination with an advanced cooling design, should enable fully passive heat dissipation via a heat sink on one side. Housed in an aluminum and zinc die-cast enclosure, the C6025 feature set includes the following:
- up to four CPU cores
- 4 GB DDR4 RAM (expandable to 8 GB)
- 40 GB M.2 SSD with 3D flash memory
- 1 x DisplayPort video connector
- 4 x USB 3.0 ports
- on-board Ethernet controller with 3 x 100/1000Base-T ports
- operating temperature range of 0 to 50° C
The C6025 IPC is designed to expand the broad PC-based control portfolio from Beckhoff to offer a performance level situated between the entry-level devices with Intel Atom CPUs and those with high-end Intel Core i-series processors. With this addition, the Beckhoff product portfolio is meant to better address the growing trend toward compact, fanless IPCs while supporting applications with highly intensive computing requirements.
