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OEM must-sees at PACK EXPO

While it may not be possible for you to go to every workshop, booth, presentation, and networking event, the Innovation Stage (located in Central Hall, Booths C-1041, C-1045 and C-1049) is one place that should be at the top of your to-do list. Every hour of the show offers something of value, whether it’s new technologies or industry-wide applications. Here are several seminars that OEMs will find to be especially interesting. For more information, visit www.packexpolasvegas.com

Oem 134096 Pe 300x200

The Best & Brightest in Standard Components: Innovations for Packaging Machinery
Matt Lunow, J. W Winco, Inc.

Monday, Sept. 28
10-10:30 a.m.
Booth C-1041
Learn about exciting developments in tube connection and conveyor components, antivibration/shock absorption mounts, and safety switch hinges.
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Compliance Life Cycle Management & TCO 
Eric Bronander, Adents Americas

Monday, Sept. 28
12-12:30 p.m.
Booth N-559
Pharma EXPO
This presentation addresses the hows and whys of Total Cost of Ownership compliance.
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Transforming Automated Packaging with Reusability
Bill McMahon, ORBIS Corp.

Monday, Sept. 28
12-12:30 p.m.
Booth C-1041
Thanks to advances in modern automated packaging systems, companies are now able to implement a reusable solution for case packing applications that meets all of their automation requirements with a drop-in replacement for fiber corrugated boxes, with significant benefits.
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Why OEE as a Metric? Learn how to Design a System to Maximize Visibility into OEE 
Katie Moore, General Electric
Chris Carlins, AutomaTech, Inc.

Monday, Sept. 28
1-1:30 p.m.
Booth C-1049
Learn how GE's OEE (Over-all Equipment Effectiveness) approach-powered by the Industrial Internet-helps manufacturers identify opportunities for immediate gains, improve efficiency, and sustain a deployment process to scale these advances across plants and multiple sites.
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Basic Production Metrics
Dave Van Laar, The Biscuit & Cracker Manufacturers' Assoc.

Monday, Sept. 28
3-3:30 p.m.
Booth C-1041
This presentation is intended for those who do not wish to become black belt six sigma experts yet desire to understand the basics of the calculations to which they are held.
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Using Robotics and Advanced Sensing Technologies to Automatically Detect Leakers
Craig Souser, JLS Automation

Monday, Sept. 28
3-3:30 p.m.
Booth C-1049
Representatives from JLS Automation will review the benefits of using robots to automatically detect leaky packages, with the major benefit being detection of EVERY package.
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Total Cost of Ownership: One Voice Guidelines for CPGs and OEMs
Steve Schlegel, OpX Leadership Network

Tuesday, Sept. 29
10-10:30 a.m.
Booth C-1041
The need for an industry norm for Total Cost of Ownership has become increasingly apparent to all stakeholders involved in the purchase/sale of capital equipment.
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Skilled Workers, Coming to a Plant Near You!
Keith Campbell, Campbell Management Services

Tuesday, Sept. 29
1-1:30 p.m.
Booth C-1041
Learn about PMMl's Mechatronics Certificate Program and the updated Manufacturing Workforce Development Playbook, published by PMMI Media Group. Become part of a collaboration among manufacturers, schools, industry associations, and other stakeholders focusing on combating the skills shortage.
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Innovation for EASY Packaging Machine Automation
Daniel Repp, Doug Burns, Lenze Americas 

Wednesday, Sept. 30
11-11:30 a.m.
Booth C-1049
Explore the latest innovations in automation, covering new software developments that dramatically reduce machine development time and simplify the programming of motion control/robotic systems.
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Fast and Accurate Load Cells for OEMs of Checkweighers, Packaging, & Sorting Machines
Bernd Knoll, HBM Test and Measurement

Wednesday, Sept. 30
12-12:30 p.m.
Booth C-1045
Next-generation of digital load cells: Fit for speed. Fit for precision. Fit for success!
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Taking the Internet of Things Beyond Data to Actionable Insights-A Component Manufacturer's Role
Jeremy King, Bimba Manufacturing

Wednesday, Sept. 30
12-12:30 p.m.
Booth C-1049
Learn how component manufacturers can create additional value by interpreting the data collected from sensors attached to their devices.

How to Honor a Leader
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago.
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How to Honor a Leader
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