The inaugural NextGen Networking Fair, a new event from PMMI, The Association for Packaging and Processing Technologies, offers a one-of-a-kind matchmaking opportunity for PACK EXPO International and Pharma EXPO 2016 exhibitors and attendees to connect with the emerging workforce.
Sponsored by B&R Industrial Automation, the event debuts on Sunday, Nov. 6, 2016 from 3:00 – 5:00 p.m. during PACK EXPO International and Pharma EXPO 2016 in the Education & Workforce Development Pavilion, in the North Mezzanine of McCormick Place. The fair provides employers in the processing and packaging industry, the opportunity to meet and connect with a targeted audience of talented students from packaging, processing, materials, package design and mechatronics programs.
