Hennepin student receives scholarship

Richard C. Ryan Packaging Education Scholarship goes to Kristin Werner.

Dorner
Dorner

Show Daily Exclusive - The Richard C. Ryan Packaging Education Scholarship, sponsored by Dorner Mfg. (Booth N-4936), was awarded to Kristin Werner, an Automated Robotics Engineering Technology student at Hennepin Technical College in Brooklyn Park, Minnesota.

Werner met rigorous criteria including a GPA of 3.0 or higher, a demonstrated commitment to excellence in the packaging industry and a history of extracurricular involvement at her school. She also wrote an essay describing her career goals in the packaging field.

The $2,000 scholarship, established in honor of Ryan, the former president and CEO of Dorner who passed away suddenly in September 2012, is awarded to a student enrolled in a two- or four-year program at any school partnered with PMMI, The Association for Packaging and Processing Technology (Booth N-4550). Ryan was a member of the PMMI Board of Directors and an advocate of lifelong learning. This commitment to education and PMMI inspired the creation of a scholarship in his name.

Sponsor the 2026 Packaging Recycling Summit
The Packaging Recycling Summit (PRS) is the premier U.S. conference for strengthening packaging circularity. In 2026, PRS is transforming into a fully immersive experience where attendees will solve problems, forge partnerships, and explore technologies that are reshaping packaging recovery. Directly connect with sustainable OEM’s at this highly coveted event.
Learn More
Sponsor the 2026 Packaging Recycling Summit
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO