Hennepin student receives scholarship

Richard C. Ryan Packaging Education Scholarship goes to Kristin Werner.

Dorner
Dorner

Show Daily Exclusive - The Richard C. Ryan Packaging Education Scholarship, sponsored by Dorner Mfg. (Booth N-4936), was awarded to Kristin Werner, an Automated Robotics Engineering Technology student at Hennepin Technical College in Brooklyn Park, Minnesota.

Werner met rigorous criteria including a GPA of 3.0 or higher, a demonstrated commitment to excellence in the packaging industry and a history of extracurricular involvement at her school. She also wrote an essay describing her career goals in the packaging field.

The $2,000 scholarship, established in honor of Ryan, the former president and CEO of Dorner who passed away suddenly in September 2012, is awarded to a student enrolled in a two- or four-year program at any school partnered with PMMI, The Association for Packaging and Processing Technology (Booth N-4550). Ryan was a member of the PMMI Board of Directors and an advocate of lifelong learning. This commitment to education and PMMI inspired the creation of a scholarship in his name.

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