GE Intelligent Platforms: Flat panel computer for harsh, hazardous environments

The Wolverine III Rugged Flat Panel Computer from GE Intelligent Platforms is designed specifically to withstand harsh, hazardous conditions including dust, shock, vibration and extremes of temperature.

Pw 29958 Webgeintel
The computer’s resistive 15-in. antiglare, scratch-resistant touchscreen is readable even in direct sunlight.  Its rugged design enables it to operate within a temperature range of -20° to +60°C as standard and to withstand extreme shock and vibration.  Its low weight of 22.5 lbs. makes it easy to install and safe and convenient to transport. The computing platform is a COM Express module and carrier board designed specifically for the Wolverine III.  At the heart of the COM Express module is an Intel® Core™2 Duo 2.26GHz processor.
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The Packaging Recycling Summit (PRS) is the premier U.S. conference for strengthening packaging circularity. In 2026, PRS is transforming into a fully immersive experience where attendees will solve problems, forge partnerships, and explore technologies that are reshaping packaging recovery. Directly connect with sustainable OEM’s at this highly coveted event.
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Sponsor the 2026 Packaging Recycling Summit
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
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List: Digitalization Companies From PACK EXPO