The PMMI Foundation, the charitable arm of PMMI, The Association for Packaging and Processing Technologies, is proud to announce the recipients of the 2025 PMMI Foundation academic scholarships. These scholarships recognize outstanding students pursuing degrees in packaging, processing, engineering, automation, and related fields at colleges and universities across North America.
This year’s awards highlight the Foundation’s commitment to preparing the workforce of tomorrow. By supporting emerging talent, PMMI is fueling the growth, advancement, and innovation that will drive the industry forward.
“These students represent the heart of the future for packaging and processing,” says Jim Pittas, president & CEO of PMMI. “Their dedication, curiosity, and drive will help our industry thrive for years to come. We extend our sincere thanks to our sponsors and partners whose support makes these opportunities possible.”
2025 Scholarship Recipients
Mark C. Garvey Scholarship: $5,000 awarded.
Established in memory of the former president and CEO of the Garvey Corporation, a PMMI Member Company. Mark Garvey was a past chairperson of PMMI and a long-time supporter of packaging education. He gave significant time and effort to technical schools in the United States and Canada.
- Ella Crespo, California Polytechnic State University, Industrial Technology & Packaging
Processing Scholarship: $5,000 awarded.
Awarded to one student attending a North American four-year college or university enrolled in a processing program.
- Adelaide Yakubison, Michigan State University, Packaging
Chuck Yuska Scholarship: $5,000 awarded.
Named in honor of PMMI's former President and CEO, who served for 28 years, this scholarship is awarded to a student representing innovation in the packaging industry
- Jordan Walz, Hennepin Technical College, Robotics
Electrical Engineering Scholarship: $5,000 awarded.
Awarded to one student attending a North American college or university with a focus on electrical and computer engineering.
- Jacob Robertson, New River Community College, Electrical Engineering Technology
Mechanical Engineering Scholarship: $5,000 awarded.
- Christian Page, University of New Hampshire, Mechanical Engineering
Packaging & Processing Women’s Leadership Network Scholarship: $5,000 awarded.
Aims to support women's careers in the packaging and processing industry.
- Brooklynn Cooper, Michigan State University, Packaging Science
PACK EXPO Scholarship: $30,000 awarded.
This scholarship is the beneficiary of PMMI’s PACK gives BACK™ events at PACK EXPO International and PACK EXPO Las Vegas. Each year, six $5,000 scholarships are awarded to students attending a college or university in North America.
- Clayton Gons, Rutgers University, Packaging Engineering
- Coleman Meagher, University of Louisville, Mechanical Engineering
- Elle Steuer, Purdue University Northwest, Mechanical Engineering
- John Emerson, Clemson University, Mechanical Engineering
- Lisbet Barragan, Michigan State University, Packaging
- Natalie Braun, Milwaukee School of Engineering, Mechanical Engineering
PMMI Member Family Scholarship: $75,000 awarded.
Awarded to employees or immediate family members of employees at PMMI member companies who are pursuing careers in the packaging and processing industry.
- Anabelle Stevenson, University of Illinois Urbana–Champaign, Mechanical Engineering
- Christian Hall, Milwaukee Area Technical College, Business Management
- Ean Crossley, University of Minnesota Duluth, Mechanical Engineering
- Emery Dooley, Auburn University, Business
- Ethan Sawyer, Tennessee Technological University, Mechanical Engineering
- Jamie Stensgard, Hennepin Technical College, Automation Robotics Engineering Technology
- Joseph McGonagle, Brown University, Chemical Engineering
- Keegan McKillip, Waukesha County Technical College, Robotics & Automation Engineering Technology
- Kelsey True, Merrimack College, Mechanical Engineering
- Laura Sitnik, Binghamton University, Mechanical Engineering
- Mitchell Kennedy, Conestoga College, Mechanical Engineering Technician, Automated Manufacturing
- Natasha Vibhakar, University of South Florida, Supply Chain Management & Finance
- Robert Wall, Purdue University, Mechanical Engineering
- Trenton Hohn, University of Iowa, Industrial & Systems Engineering
- Ryan Monroe, University of North Carolina Charlotte, Electrical Engineering
PMMI scholarship in memory of Claude S. Breeden, Glenn Davis, and Art Schaefer: $28,000 Awarded.
Established in memory of Claude Breeden, Glenn Davis, and Art Schaefer. All of whom were industry leaders and committed to education and workforce development.
- Blake, Strickland, East Carolina University, Industrial Engineering Technology
- Caleb, DeAtley, Shawnee State University, Electromechanical Engineering
- Jacob, Kuenzi, Chemeketa Community College, Mechanical Engineering
- Madeline, Kovanda, Front Range Community College, Mechanical Engineering
- Mason, Jochim, Hennepin Technical College, Automation Robotics Engineering Technology
- Michael, Orren, Hennepin Technical College, Mechatronics
- Vincent, Meyer, Hennepin Technical College, Robotics Engineering
In addition to academic scholarships, the Foundation continues to fund summer manufacturing camps, student travel assistance to PACK EXPO International, Skills Fund matching grants, and other initiatives designed to engage and develop the next generation of packaging professionals.
For more details about the 2025 scholarship recipients and how to support the PMMI Foundation, visit pmmifoundation.org.
