Weight processing module for Rockwell systems

Is easy to mount, set up, calibrate and maintain

Aug 10, 2017

Hardy HI 1734-WS POINT IO Series Weight Processing Module

Hardy HI 1734-WS POINT IO Series Weight Processing Module

Hardy Process Solutions

List: Digitalization Companies From PACK EXPO

List: Digitalization Companies From PACK EXPO

Ori Cohen, president and founder of Orics Industries, is shown here in the firm’s 40,000 square foot manufacturing facility in Farmingdale, N.Y.

OEM Profile: MAP put Orics on the Map

Orics Industries was a pioneer in MAP just as it began to take off. Now it builds equipment for businesses, including everything from produce to meat to dairy to orthopedic implants.

Teams compete with their packaging machinery at PACK EXPO International after a semester and a half of building.

How The PACK Challenge Builds Tomorrow’s Packaging Workforce

Four key recommendations surface for OEMs to improve their offerings.

Actionable Steps to Improve Aftermarket Parts and Services

Y229wej K 720

Survey: Automation and Robotics Makes Its Way to Secondary & End-of-Line

Safety Upgrade Boosts Finnish Cable Maker's Productivity

Safety Upgrade Boosts Finnish Cable Maker's Productivity

List: Digitalization Companies From PACK EXPO

Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.

List: Digitalization Companies From PACK EXPO

Products

Advanced Seal Inspection System For Closed Valve Bags

Seal Inspection System for Closed Valve Bags

Premier Tech Systems and Automation's seal inspection technology for valve bagging systems uses thermal imaging and AI to detect defects and ensure leak-free packaging.

Wrap Coupling

AFA Systems to Showcase New Case Packing Platform for Bottles at PACK EXPO 2025

OEM Magazine Summer OEM 2025

Summer OEM 2025

OEM Magazine Spring OEM 2025

Spring OEM 2025

OEM Magazine Winter OEM 2024

Winter OEM 2024

OEM Magazine Fall OEM 2024

Fall OEM 2024

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Researched List: Digitalization Companies from PACK EXPO, catered to CPG

Pw Robotics 1 E Book 2024 Cover Fullsize

Rethinking Packaging Robotics: Prioritizing Flexibility to Combat “Brittleness”

557 Oem Language Models

Researched List: Small Language Models for Packaging & Processing OEMs

Oem 2022 Digitalization Base Hero

The Digitalization Effect