Subscribe
Engineering
Business
PMMI News
Partner Leaders
Downloads
I/O & Wiring
Conveying
Bradman Lake Showcases Next-generation Packaging Automation at PACK EXPO International
Bradman Lake Inc.
See Bradman Lake's FT-iFLEX Flow Wrapper, Intelligent Motion Loader (IML), SL903 End Load Cartoner, HS Carton Former, IL120 Carton Closer, and IB30 Bagger In Booth S-1742.
October 19, 2026
Automation
Compact Electronic Vacuum Sensors and Switches
Piab Group
Piab launches PS Series: PS.VA, PS.VS and PS.VSI sensors give manufacturers clearer vacuum feedback, easier setup, and stronger integration into modern automation systems.
October 16, 2026
Automation
At PACK EXPO 2026, Festo Showcases Solutions that Reduce OEM Engineering
Festo Corporation
New motion, gripping, connectivity, and handling solutions help OEMs build machines ready for changing requirements. Learn more in Booth N-6132.
October 13, 2026
I/O & Wiring
Embedded Communication Module
Hilscher North America, Inc.
Hilscher's comX 90CN for secure embedded industrial communication in space-constrained devices gives device manufacturers greater flexibility in network interface placement.
October 12, 2026
Automation
Emerson to Present Pressure, Motion and Control Solutions at PACK EXPO 2026
Emerson
Emerson's solutions are designed to stabilize processes across high-speed packaging lines. Find out more in Booth N-5449.
October 9, 2026
Automation
Murrelektronik Brings Decentralized Automation to PACK EXPO International 2026
Murrelektronik, Inc.
At Booth N-5745, Murrelektronik will show IO-Link connectivity, machine control, circuit protection, and power distribution technologies designed to simplify packaging machinery.
October 5, 2026
I/O & Wiring
End of the Line
Video Series
:
How Packaging Plays into Public Health Preparedness, Cybersecurity, and Navigating Multiple SKUs in the Supply Chain
Tune in to hear about EPR regulation's sliding scale, cybersecurity risks you haven't considered, and insights into supply chain forecasting.
October 5, 2026
Automation
iAutomation Unlocked: iAutomation to Host Midwest Open House at Fond du Lac, WI, Facility
iAutomation, a division of CAS Holdings
The Oct. 8 event will feature facility tours, automation demonstrations, and technology from EXM, WeidmĂĽller, Doosan, B&R, 80/20, and ABB Drives.
September 22, 2026
I/O & Wiring
Remote I/O Modules
Dinkle Corporation
Daudin iO-GRID NEMO modules are a practical option for connecting small quantities of grouped I/O signals—ideal for applications like data centers, building automation, utility systems, and more—and integrating them with host systems using the leading industrial Ethernet communications protocols.
June 16, 2026
I/O & Wiring
Fieldbus Modular Remote I/O Series
Dinkle Corporation
With support for the most popular industrial communications protocols and an expansive variety of I/O modules, the Dinkle iO-GRID X remote I/O series removes barriers for delivering smart factory integration.
June 2, 2026
I/O & Wiring
Intelligent End Plates
Festo Corporation
Festo's intelligent end plates for remote I/O system expansion extend system flexibility across zones, simplifying hybrid layouts and speeding commissioning.
May 4, 2026
PACK EXPO
PACK EXPO East 2026 Kicks Off Today, Delivering Live Machinery, Big Ideas, and Easy Access for East Coast Professionals
PACK EXPO East opens in Philadelphia, bringing 500 exhibitors, new show floor features, free education, and high-impact networking for packaging and processing professionals.
February 17, 2026
Page 1 of 7
Next Page
Top Stories
Business Intelligence
Co-packers Lead Demand for Equipment Built to Handle Enhanced Formulations
Contract manufacturers are the most frequently cited source of demand for formulation-capable equipment, narrowly ahead of brand owners, as outsourcing pushes OEMs toward machines that can switch products and formats quickly.
OEM Profiles
Van der Graaf's Four-Decade Bet on Drum Motor Specialization
PMMI News
Meet PMMI's 2026 On the Rise Winners
PACK EXPO
Team 26 Races to Victory in the 2026 Amazing Packaging Race at PACK EXPO International
Sales & Marketing
Exhibitor's Corner: Why the Show Floor Matters More than Ever
Products
Box Dumper
Flexicon's light curtain-equipped TIP-TITE streamlines handling and enhances safety.
Bradman Lake Showcases Next-generation Packaging Automation at PACK EXPO International
Compact Electronic Vacuum Sensors and Switches
More Products
In Print
Fall OEM 2026
Summer OEM 2026
Spring OEM 2026
Winter OEM 2025
Subscribe
Archives
Downloads
View More »
Automation
Guideposts to Engineering the Modern Plant
Automation
A Practical Guide to the Future of Automation
Automation
A Guide to Evaluating Linear Track & Planar Systems
Automation
AI Hits the Plant Floor
View More »